Склад 19, стр.43

Standard heatspreader for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole

Thin Mini-ITX board based on Intel® Atom™ x5-E8000 quad core processor with 1.04GHz up to 2.0GHz, 2MB L2 cache and 1600MT/s dual channel DDR3L SODIMM memory interface.

Прямоугольный дисплей, диагональ: 1,77 дюйма; Разрешение:128 x 160; Яркость:850 кд/кв.м; Интерфейс SPI, LED подсветка; Контрастность:700:1; Температура хранения:-30…+80С; Углы обзора 45/30/45/45 ;

Standard heatspreader for COM Express Type 10 modules conga-MA3 and MA3E. All standoffs are M2.5 thread.

Круглый дисплей, диагональ: 1,3 дюйма; Разрешение:240 x 240; Яркость:280 кд/кв.м; Интерфейс SPI, LED подсветка; Контрастность:800:1; Температура хранения:-30…+80С; Углы обзора 80/80/80/80 ;

диагональ:5,49 дюйма; Разрешение:1080 x 1920; Яркость:350 кд/кв.м; Интерфейс Mipi, LED подсветка; Контрастность:900:1; Рабочая температура:-20…+70С; Углы обзора 80/80/80/80 ; PCAP(со стеклом, черная рамка)

DC-DC SIP7, 1Вт, вход 24В±10%, выход 5В/200мА, изоляция 1000В DC, в корпусе на печатную плату 19.5×7.1×10.2мм, -40…+85°С

Thin Mini-ITX board based on Intel® Pentium® N3710 quad core processor with 1.6GHz up to 2.56GHz, 2MB L2 cache and 1600MT/s dual channel DDR3L SODIMM memory interface.

Standard heatspreader for COM Express Compact modules conga-TC370 with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5.

Four Channel Differential Line Receiver

Qseven module with ultra low power NXP ARM® Cortex® A9 dual core 1GHz processor with 512kB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. MAP BGA plastic package.Commercial temperature range.

Standard heatspreader for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.

Standard heatspreader for COM Express Type 10 module conga-MA3, conga-MA3E and conga-MA4. All standoffs are M2.5 thread.

Thin Mini-ITX board based on Intel® Core™ i3-6100U dual core processor with 2.3GHz, 3MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-U).

Small form factor µQseven module with ultra low power NXP ARM® Cortex® A9 Dual Core 1GHz processor with 1MB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Commercial temperature range.

Standard heatspreader for Qseven modules conga-QA3, QA3E and QA4. All standoffs are M2.5mm thread.