Склад 19, стр.35

DC-DC SIP7, 1Вт, вход 5В±10%, выход 5В/200мА, изоляция 1000В DC, в корпусе на печатную плату 19.5×6.1×10.2мм, -40…+85°С

Standard heatspreader for COM Express Type 10 module conga-MA3, conga-MA3E and conga-MA4. All standoffs are M2.5 thread.

Small form factor µQseven module with ultra low power NXP ARM® Cortex® A9 Dual Core 1GHz processor with 1MB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Commercial temperature range.

Standard heatspreader with 1mm gap pad for Qseven module conga-UMX6 with processors with LIDDED FCBGA package (PN: 016212).

LVDS pin header evaluation adapter for congatec Thin Mini-ITX boards)

Thin Mini-ITX board based on Intel® Core™ i3-6100U dual core processor with 2.3GHz, 3MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-U).

Standard heatspreader for Qseven modules conga-QA3, QA3E and QA4. All standoffs are M2.5mm thread.

Thin Mini-ITX board based on Intel® Atom™ x5-E8000 quad core processor with 1.04GHz up to 2.0GHz, 2MB L2 cache and 1600MT/s dual channel DDR3L SODIMM memory interface.

COM Express Type 6 Compact module with Intel® Celeron® Processor 2980U dual core processor with 1.6GHz, 2MB L2 cache and 1600MT/s dual channel DDR3L memory interface. Features legacy VGA display interface.

Standard heatspreader with 1mm gap pad for Qseven module conga-QMX6 with processors with LIDDED FCBGA package (PN: 016112, 016113). Threaded standoffs, M2.5.

Standard heatspreader for COM Express Compact modules conga-TC370 with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5.

DC-DC SIP7, 1Вт, вход 24В±10%, выход 5В/200мА, изоляция 1000В DC, в корпусе на печатную плату 19.5×7.1×10.2мм, -40…+85°С

Standard heatspreader for COM Express Type 10 modules conga-MA3 and MA3E. All standoffs are M2.5 thread.

COM Express Type 6 Compact module with Intel® Core™ i5-8365UE quad core processor with 1.6GHz, 6MB L2 cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (15W).

Standard passive cooling solution for COM Express modules conga-TC87. All standoffs are M 2.5 threaded

Standard active cooling solution for high performance COM Express modules conga-TS67/TS77 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.

Small form factor µQseven module with ultra low power NXP ARM® Cortex® A9 Single Core 1GHz processor with 512kB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Commercial temperature range.

Standard heatspreader for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole

Муфта 3 конт. электромонт. IP68, для соед. 2-х кабелей (сеч. пров. 0.5 - 2.5 кв.мм/ под пружинные зажимы), кабель-вводы под диам. 9.0 - 12.0 мм (с силикон. уплотн.), до 400В/24А макс. (черн. изол. PA66), от - 40 до + 105 гр.C

DC-DC SIP7, 2Вт, вход 5В±10%, выход ±15В/±66мА, изоляция 1000В DC, в корпусе на печатную плату 19.5×7.6×10.2мм, -40…+85°С

Дроссель выводной 8.0*10.0мм, 4.7мкГн, 20%

Дроссель выводной 8.0*10.0мм, 68мкГн, 10%

Дроссель выводной 13.0*19.0мм, 560мкГн, 10%